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Flow soldering is the most common method of attaching surface mount components to a circuit board. The goal of the Flow process is to melt the solder and heat the adjoining surfaces, without overheating and damaging the electrical components. In the conventional Flow soldering process, there are usually four stages, called "zones", each having a distinct thermal profile: preheat, thermal soak (often shortened to just soak), flow or reflow, and cooling.

Soldering & Micro Soldering Rework

All Types Of Rework Undertaken

Hot Air Rework Station

We Reball Most Chips

PS3 GPU & Balling

Chip Migration

Rework on PS3 Daughter Board

We PCB Rework

Rework Nokia Mobile

All Types Of Rework Undertaken

ITE ECC Trace Rework

Chip Migration We PCB Rework

Standard Soldering Rework

All Types Of Rework Undertaken

PS4 HDMI Socket Rework

Chip Migration

PS4 HDMI Scalier Rework

We PCB Rework

PS4 HDMI Pad Tint

iPhone 6 Rework on U2 IC

We offer Standard Soldering Iron Rework, Micro Soldering, Re-Flowing and Re-Balling on all Printed Circuit Boards from motherboards, engine management unit boards for car’s, bikes and all electrical or electronic devices in your home or at work. just bring the device with or without the new or damaged component that needs replacing, it’s that simple.